The 2014′s iPad Version to Equip with Quad-core Chip on a 20nm Die?
At this definitive era of enchantress of nanotech, development comes across even in the borders of merger and partnership. The industry has been quite accustomed with innovating designs to procure public want. Hence, rumor has it that TSMC is soon to be found in future Apple products.
Research by J.T. Hsu of Citigroup Global Markets thru MacRumors quoted-in by Taiwan Economic News details Taiwan Semiconductor Manufacturing Co. (TSMC) and its 20-nanometer quad-core chips are most likely to be seen in a future iPad, Apple Television or MacBook computer. However, Hsu indicated that future iPhones are expected to continue to feature dual-core processors, due to power consumption issues. This is expected to be materialized by 2014.
Apple and TSMC had had prior work relations. Apple even attempt to buy TSMC services exclusively. Nevertheless, the recent A6 generation is manufactured by Samsung.
Nonetheless, it’s rumored that the A7 will be a TSMC product. Surprisingly, the die is 20nm, which is significantly smaller than the current 35nm die. The 35 nm is used in the third-generation iPad. As what it befits, dies smaller in size have significant advantages; they are faster and denser.
Furthermore, they use less power. It appears that the production of these new chips won’t begin until the second half of 2013.